Fujifilm to Produce Key Materials Required for Semiconductor Production

On September 8th, Fujifilm of Japan announced that it will invest approximately ¥2 billion ($14 million) to produce key materials for manufacturing semiconductors. 

Fujifilm Electronic Materials, the core company that leads Fujifilm’s electronic materials business, will introduce a state of the art facility for producing Chemical Mechanical Polishing (CMP) slurries, which are key materials used in semiconductor manufacturing, and will supply CMP slurries to Fujifilm Kyushu Compay, Fujifilm’s production subsidiary based in Kumamoto Prefecture.  CMP slurries are used to polish and planarize complex layers of integrated circuits to customer requirements.

The facility will be Fujifilm’s first CMP slurries production facility in Japan and will be operational in January 2024.

According to Fujifilm, the advancement of artificial intelligence, Internet of Things, 5G, and the expansion of self-driving technology are expected to drive strong demand and performance enhancement of semiconductors. Now more than ever, the company says it’s becoming critically important to provide a stable supply of high-quality and high-performance semiconductor materials.

The firm says it will invest its production of CMP slurries in the United States, Taiwan, and South Korea and achieve local production of CMP slurries, ensuring a stable supply from four production sites.

Fujifilm Electronic Materials will also introduce a production facility for CMP slurries within Fujifilm Kyushu’s factory, which is a main production site for display materials requiring high quality management.

The company also says it will promote growth strategies including  capital investments in order to achieve sustainable growth of its electronic materials business. It says it’s also committed to providing technology advancements for the semiconductor industry through its broad product portfolio that includes CMP slurries, post CMP cleaner, photoresist, photolithography-related materials, polyimide, and image sensor materials.

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